SK 海力士 SK hynix Inc.

“Capacity specifications cover up to 512GB based on two stack configurations (8-high and 16-high NAND dies). Bandwidth is categorized into three grades (Grade1~3), delivering scalable performance from approximately 0.4TB/s to 3.0TB/s. … HBF technology adopts UCIe…”

“Revenue … 79,318,746 (Current Period, Second quarter of 2026, millions of Won) … Year to Year Changes 256.8 ／ Operating Profit … 60,542,608 … 557.2 ／ The preliminary results … may differ from the final results.”

“[p10] Concluded around 10 LTA negotiations including key customers… Pricing structures designed to address price volatility, while varying by customer and product characteristics… Financial mechanisms(e.g. deposits) incorporated to support contract fulfillment ／ [p11] Began HBM4 shipment in Q2, with customer-required speeds · industry-leading power efficiency · cost competitiveness. Full ramp up planned in 2H …”

“The company showcases its 16-layer HBM4 with 48 GB, a next-generation HBM product, for the first time during the exhibition. It is the next-generation product of the 12-layer HBM4 with 36 GB, which demonstrated the industry’s fastest speed of 11.7 Gbps, and is under development aligned with …”

“As the DRAM chips had to be 40% thinner than the chips used in the 8-layer HBM3 in order to maintain the product's overall thickness, chip warpage became a significant issue.”