事實(公司自述/申報)Micron Technology(8-K Exhibit 99.1 新聞稿,BOISE, Idaho, September 30, 2026)2026-09-30
營收 542.3 億美元,前一季 414.6 億,去年同期 113.2 億。
原文
“Revenue of $54.23 billion versus $41.46 billion for the prior quarter and $11.32 billion for the same period last year”
位置:Exhibit 99.1「Fiscal Q4 2026 Highlights」第一點;文首「BOISE, Idaho, September 30, 2026 – … fourth quarter and full year of fiscal 2026, which ended September 3, 2026」・原件 ↗
事實(公司自述/申報)美光(Form 10-Q FY2026 Q3,MD&A)2026-06-25
DRAM 營收比去年同期多了 343%,主要是平均售價漲了兩倍半以上,出貨的位元數只多了兩成左右。
原文(節錄)
“Sales of DRAM products increased 343%, primarily due to a low-260% range increase in average selling prices and a low-20% range increase in bit shipments. / Sales of DRAM products increased 211%, primarily due to an approximate 140% increase in average selling prices and an approximate 30% increase …”
“Strategic customer agreements are structured as take-or-pay agreements, with binding commitments for specific volumes over the multi-year contract terms. Pricing for most agreements is either fixed, or is subject to minimum and maximum pricing. The largest agreements generally have a ceiling price for existing products that approximates the market price in the second calendar quarter of 2026, and a floor price through the term of the agreement. …”
HBM 效能高、製程複雜,在同一個製程節點要做出同樣多的位元,得用掉比一般 DRAM 更多的晶圓、更多的無塵室。反過來說,如果 HBM 需求轉弱、各家把產能挪回一般 DRAM,一般 DRAM 的供給可能大增,價格也可能被往下壓。
原文(節錄)
“Due to the higher performance and more complex manufacturing process, HBM requires a higher number of wafers and more cleanroom space to produce the same number of bits as conventional DRAM in the same technology node. If demand for HBM weakens and suppliers shift capacity from HBM to conventional DRAM, this could result in a significant increase in conventional DRAM supply. …”
“These barriers include achieving acceptable yields and quality for HBM products with their multiple chip layers, potential limitations on stacking additional 3D memory layers, increasing bits per cell…, meeting higher density requirements, developing advanced packaging solutions, improving power …”